2023

Moved to a new manufacturing facility,strengthening our competitiveness in High-Mix&Low-Volume(HMLV)electronics manufacturing.

2022

Invested the new SMT machine equipment.

2020

Received ISO 9001:2015 certification upgrade.

2016

PCB assembly division DYKOO found.

2010

Hong Kong and U.S.Sales Representative Offices Officially Launched

2005

Focus on multi-layer PCB fabrication from 4L up to 10L,and started HDI PCB fabrication(1+n+1)with micro-via holes by laser drilling.

2003

Started rigid PCB fabrication from 2L up to 10L.